Eltec Technology GmbH
Eugen-Sänger-Ring 17
85649 Brunnthal

Tel.: +49 89 / 629844-0 E-Mail: mail@eltec-gmbh.de
Web: www.eltec-technology.com
Eltec Technology GmbH Technology Consulting


Process-reliable production with one hundred percent inspection

At Eltec Technology, the respective IPC guidelines support the entire product creation process. These also define which test and measurement procedures are used when and how. In addition, assemblies must be subjected to a hundred percent visual, mechanical and electrical test after each production step. The result is a product of the highest quality and reliability.

The IPC was founded in 1957 in Bannockburn, Illinois, under the name Institute for Printed Circuits. The IPC sees itself as a worldwide trade association and standardization organization for the electrical and electronics industry.

IPC guidelines that affect wire harnesses and electronic assemblies:

IPC/WHMA-A-620 defines the requirements and acceptance criteria for cable and harness assemblies. Materials, methods, test procedures and acceptance processes for the manufacture of crimped, mechanically secured or soldered connections are described. Also, the assembly activities associated with the cable and harness assemblies. IPC/WHMA-A-620 was developed jointly by the IPC and the Wiring Harness Manufacturer's Association (WHMA), an IPC member organization.

IPC J-STD-001 describes the requirements for soldering materials and processes for electronic assemblies. This covers soldering methods, process parameters, the appearance of a soldered joint, tolerances or the environment in which soldering takes place. The permissible quantities of flux and other residues in soldering and cleaning processes are also an important aspect.

IPC-A-610 deals with the visual inspection of the quality of electronic assemblies and thus with acceptance criteria that lie outside IPC J-STD-001. These criteria are defined, for example, for flex assembly, printed circuit board in printed circuit board or component on component. Likewise for lead-free and tin-lead processes. Soldering criteria for assemblies in through-hole and SMD technology are also taken into account, as are cleaning, marking, protective coating and laminate requirements.

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